South Korean memory maker SK hynix plans to invest $4 billion to build an advanced packaging plant in the United States. Insiders report this to The Wall Street Journal. The factory will be located in the state of Indiana.
Sources report to the American newspaper that the factory should be operational in 2028. The company has not yet officially confirmed the plans. It is considering investments in advanced chip packaging in the US but has not yet made a decision, the company said in a statement. During that process, individual chipdies are packaged into a working chip.
SK hynix said in 2022 that it wants to invest up to 15 billion dollars in the United States. In addition to the construction of an advanced packaging factory, the company also wants to invest in R&D programs there. The memory maker said it recently started production of HBM3E memory, which will be used in the data center GPUs of Nvidia, among others.