The leaked MSI MEG X670E Godlike board design for AMD's upcoming Ryzen 7000 (“Raphael”) series desktop processors based on the new Zen 4 architecture shows very powerful voltage modulation, which uses a 24+2+1 phase design and 105 ampere MOSFET.
27 phases for AMD Ryzen 7000
The website wccftech.com has the expected technical specifications and drawings as well as images of the MSI MEG X670E Godlike from its own sources. The PCB design of the expansive 305 × 288 mm main board in E-ATX format shows a potent power supply.
The website speaks of a “24+2+1 Phase (105A) CPU VRM Design” and further of “105A MOSFETs” and “Dual 8-Pin Power Connectors for CPU”, indicating an upcoming spearhead in MSI's AM5 portfolio seems appropriate. It remains to be seen how the phases will be switched (addressed in groups by the VRM controller).
Some manufacturers were already leading AM4 for the release of Ryzen 5000 (test) in November 2020 mainboards with a potent voltage range, but with Zen 4 on the X670E chipset, it will be significantly upgraded again.
The direct predecessor, the MSI MEG X570 Godlike from 2019, still managed with a total of 16 phases and MOSFETs with 70 amps each.
Raphael with Zen 4 is said to increase single-core by over 15 percent. The IPC should increase by 8 to 10 percent, the further increase in performance comes from the higher clock. In all probability, this will not be possible without higher consumption even in the new 5 nm process, which is why the TDP in the future will be up to 170 watts and the PPT of the socket AM5 will even be up to 250 watts. To date, the maximum TDP was 105 watts, the PPT a maximum of 142 watts. MSI apparently takes this into account with the MEG X670E Godlike and at the same time once again emphasizes the special suitability of the mainboard for overclocking.
Up to 128 GB DDR5-5600+ (OC)
The VideoCardz website, which already has the official data sheet of the MSI MEG X670E Godlike, reveals more information. The AM5 motherboard has the following technical specifications:
- Support for desktop AMD Ryzen 7000 series CPUs
- Support for up to 128 gigabytes of DDR5-5600+ (OC) with AMD EXPO
- 24+2+1 phase design with 105 amp MOSFETs
- Dual X670E “Promontory” PCH (“AMD X670E”)
- 2 Oz copper PC with 10-layer design
- 3× PCIe Gen 5.0 x16 (x16/x8/x8)
- 4× M.2, 1× PCIe 5.0, 3 × PCIe 4.0
- 2× USB 3.2 Type-C Gen 2×2
- Wi-Fi 6E with 2×2 MIMO
- 305 × 288 mm
*) not officially confirmed!
MSI MEG X670E Godlike Specifications (Image: VideoCardz)
Official details should follow on August 4th
On August 4th, AMD and its partners Asus, ASRock, Biostar, Gigabyte and MSI will show their motherboards with the Chipsets X670 and X670E for the upcoming AM5 platform and Ryzen 7000 with DDR5 and PCIe 5.0.
- AMD X670 and X670 Extreme: Boards for Ryzen 7000 will be shown on August 4
Under the title “A Showcase of The New AM5 Motherboards”, AMD and its five partners invite you to a first showcase in which the respective flagships of the manufacturers will be presented in detail.
The new spearheads from Asus, ASRock, Biostar, Gigabyte and MSIThe five AM5 motherboards Asus ROG Crosshair X670E Extreme, ASRock X670E Taichi, Biostar X670E Valkyrie, Gigabyte X670E Aorus Extreme and MSI MEG X670E Ace should be the focus and in a showcase be presented in more detail. After the “leak” of the MSI model, it would not be a surprise if the other boards also made an appearance in the rumor mill by then.