Chipproducent TSMC has provided an insight into his future productieproced lwa’s. The Taiwanese company will early next year begin the production of 20nm chips and the next ‘node’ would be a year later.
According to Morris Chang, the ceo of the Taiwan Semiconductor Manufacturing Company, see the company’s 20nm – and 16-nm process’s actually as a single virtual node. This year, TSMC is already five so-called tape-outs at 20nm realized and will in the first quarter of 2014 with mass production of the first designs to start. In total, says TSMC next year, more than thirty designs with the CLN20SOC with hkmg process. Among the designs are socs for mobile applications, cpu’s and pld’s.
The production of 20nm chips will be in multiple fabs to take place, which TSMC assumes large numbers to be able to produce. The company says the production faster scale than the 28nm node. The expected revenue from 20nm production in 2014 would be higher than the revenues of 28nm in 2012. This list is TSMC the so-called ‘disasters’, either the scale of the production, always better to get the hang of: the 28nm-disaster was already a record for the company, but the 20nm-disaster would be another 30% faster, says Chang.
Even smaller transistors will a year later will be produced: the 16nm process, which TSMC the CLN16FF-node calls, a year after the 20nm node to follow. The FF of the name refers to the use of finfets, a transistortype with a larger gate which is also by Intel is used, but then trigate-transistor. TSMC is expected in 2015, approximately twenty-five designs at the 16nm production. The company thinks the next time will be the only supplier for products at the two nodes.
