Intel wants to start chip production in 2027 using a 10A process. The company shared this during a presentation at its IFS Direct Connect event. Production on the previously announced 14A process should start in 2026.
Intel mentioned the arrival of its 10A process for the first time during a private presentation, reports Tom's Hardware, which was present at IFS Connect. Production on that 10A process should start at the end of 2027. The name of that node refers to 10 angstroms, which equates to 1nm. During the presentation, Intel CEO Keyvan Esfarjani will share details about the expected number of weekly wafer starts on various processes. It shows that the first 10A wafers will start the production process towards the end of 2027, although this will be a relatively small number.
Production on the 14A process, which Intel already announced last week, will start in 2026 and be scaled up in 2027. This will be the first node for which Intel uses high-NA-EUV machines from ASML. This next generation of EUV lithography offers a higher numerical aperture, or NA, which enables higher resolutions and therefore the production of smaller transistors. Intel was unclear last week about when exactly 14A production would begin, although the company did confirm at the time that an improved 14A-E node would arrive in 2027.
Intel also said during the presentation that its will expand production capacity for advanced packaging. Intel's techniques such as EMIB and the Foveros family are used to combine multiple chips or chiplets into one working whole. These types of packaging techniques are currently mainly used for the production of AI accelerators, such as Nvidia's H100 and AMD's Instinct MI300 chips. Packaging capacity is currently a bottleneck. According to rumors, Nvidia will switch to Intel's packaging factories partly because main supplier TSMC cannot supply sufficient capacity.
Leave a Reply
You must be logged in to post a comment.