Phoenix comes later: AMD is now officially postponing the Ryzen Mobile 7040HS


Lots of publicity at CES 2023, then dead silence: AMD's only really new notebook platform isn't gaining momentum. The Ryzen 7040HS “Phoenix” series with Zen 4 cores and RDNA 3 iGPU will now officially be released in April. Since the models of the 7045HX “Dragon Range” family weren't on time either, that's not surprising.

It's a curious start that AMD is delivering in notebooks this year: While Ryzen, Radeon and Genoa were accompanied with big events at the market launch, has not happened with notebooks. The group has not yet provided any samples either.

The presentation at a trade fair and now a dabbling start with the Ryzen 7045HX, the fastest class of the generation, is surprising, since these CPUs do not have to hide from Intel. Whether this will be different with the real APU “Phoenix” remains questionable.

Ryzen 7000 Mobile: It's (not so) complicated

As a reminder: If you want to understand AMD's new Ryzen 7000 mobile portfolio, you have to be aware of two very important properties, otherwise it will be difficult:

  1. The largest series (Ryzen 7045HX), unlike all others and its predecessors, does not rely on the APU approach with a monolithic die, but adopts Ryzen's chiplet I/O die approach from the desktop.
  2. AMD Ryzen 7000 Mobile includes processors based on very different generations of Zen architecture: Zen 4, Zen 3 and Zen 2.

The The following table provides an overview of the concrete implementation of what has just been said in five separate Ryzen 7000 mobile series.

Series Classes Approach Zen architecture/iGPU cores Ryzen 7045 “Dragon Range” HX Chiplet I/O Die Zen 4 (5nm)/RDNA 2 6 – 16 Ryzen 7040 “Phoenix” HS, U APU (monolithic) Zen 4 (4nm)/RDNA 3 6 – 8 Ryzen 7035 “Rembrandt -R” Zen 3+ (6nm)/RD NA 2 4 – 8 Ryzen 7030 “Barcelo-R” U Zen3 (7nm)/Vega 6 – 8 Ryzen 7020 “Mendocino” Zen 2 (6nm)/RDNA 2 2 – 4