The reports about the expansion plans of TSMC do not stop, new rumors say that in addition to the planned semiconductor factory and possibly several expansion stages (phases), a packaging fab could also be built in the USA .
The fact that packaging is very popular at TSMC became clear over the past few weeks when AMD unveiled its first solution with TSMC-SoIC (System on Integrated Chips) . A few days later, TSMC announced various details and expansion plans and plans to build a large complex in Taiwan within a short period of time that primarily deals with packaging.
One would be in the USA Factory a first for TSMC. However, the Nikkei report does not yet provide any further details than the possibility of the location; it merely repeats the already known statements and options in the USA. As with other rumors in this direction, such as the recently announced possible new TSMC factory in Japan, it is important to wait for the coming weeks and months.