GlobalFoundries demonstrates technique for stacked chips

Chip maker GlobalFoundries has a testchip has developed a TSV technology, the company demonstrates. With Through Silicon VIA-technology-chips can be stacked.

Stacking chips should be smaller chippackages result. It is now also applied, but then only with separate chips, was realized. The connections run it externally, and are relatively slow. The use of Through-Silicon Vertical Interconnect Access programs, in which interconnects and tunnel through the different slices of silicon of the stacked chips walk, provides the shorter distances and a greater number of connections better performance. GlobalFoundries has this technology demonstrated with the 20nm chips.

With the TSV’s will GlobalFoundries so-called 3d chips on 20nm. It would be different types of chips, such as flash memory, ram and rekencores can be combined. GlobalFoundries has sram dies connected to each other, whereby the 20nm 3d-chips as well worked as a separate 20nm chips. The testchips of GlobalFoundries would be the first working chips with TSV’s on 20nm.

A GF technique developed at the contacts of the copper interconnects to protect the add of TSV’s on the previously developed 20nm-production methods are relatively simple to create. The next step for GlobalFoundries, the production of 3d-testchips, which allows partners to get started. That would then side-of-the-box 3d libraries can use their products to develop.