Toshiba has announced the first nand flash chips manufactured to comply with the ufs standard. The Jedec-standard ufs need higher data transfer rates yield and, ultimately, the current standard eMMC replace.
The Toshiba-manufactured chip-with-interface has a lane for upstream and one for downstream. Both channels have a bandwidth of 2.9 Gbit/s and in full-duplex mode to work. In version 2.0 of the ufs standard, there must be support for the use of different lanes, so the speed can be increased. The chips, especially for smartphones and tablets are intended, are a lot smoother than the current eMMC standard, which offers space for up to 200MB/s
The ufs standard is backed by major brands, such as Qualcomm, Samsung Electronics and Nokia, which makes it plausible that there are ufs-chips in these products will prevent. The Jedec association had been wants the ufs standard is ultimately, except in the loose chips, also shown in flash-memory cards. At this time, the SD Association is dominant in that area. At present, it is the 64GB chip, which Toshiba has developed, used to the ufs interface to test. Toshiba enables mass production of the chips until there is enough demand. By that time we will also versions with other capacities are available. What geheugengroottes that will be, is not yet known.