The Dutch lithografiebedrijf ASML, equipment for wafer production builds, has announced collaboration with the Japanese Tokyo Electron Limited. The businesses are going technology for 22nm and smaller proced lwa’s development.
The Veldhoven-based ASML announced the cooperation with TEL, with the promise of euv equipment to work. The agreement includes the cooperation for lithography equipment, used in chipproductie, to exchange and to demonstrate to intended customers. TEL will send a so-called euv coater/developer to Veldhoven, the netherlands, and is in the r&d lab in addition to ASML’s TwinScan system. That should provide the means to euv techniques for processes of 22nm and smaller to develop.
Including ldr, or straight lines in the masks, and error prevention get attention. In addition to euv techniques, both companies are also existing techniques for wafer production develop. Thus, ArF-immersielithografie also be further refined and must the end with which the equipment is increased.
Euv, or extreme ultraviolet, is a technique that allows for smaller details on the silicon wafers to apply light with a very short wavelength to use. The necessary equipment for this purpose, however, to wait for, reason for chip manufacturers like Intel to existing techniques even for smaller processes. With the euv technology should be easier to find patterns on wafers to convey for 22nm and smaller processes.
