The USB Implementers Forum the usb 3.0 standard to use as interconnect between different chips. This would mean that bottlenecks in bandwidth in smartphones and tablets need to be taken away.
The new standard by the USB Implementers Forum, a consortium for the usb specification is responsible, it is proposed, would the current interfaces between chips in smartphones and tablets need to be replaced. They now have standards as gpio, mipi, and hsic. That last is based on usb 2.0, and would like a springboard may be used for the further development of an interconnect based on the usb 3.0 standard. The new version would be a speed increase from 480Mbps to 5Gbps may make a difference.
The usb 3.0-based interconnect would ssic or Super Speed Inter-Chip, analog to hsic, and in different bandwidths available. The ssic interface would be about x1,- x2 and x4 lanes going to offer, but specifications are not yet known. It is likely that x4-lanes about the maximum to 5Gbps bandwidth of the standard. The x2-lanes would probably be half of the bandwidth, or 2.5 Gbps and x1 lanes would with 1.25 Gbps should do.
For the new ssic interfaces in mobile devices are implemented, the standard that must be developed: that would be in the course of 2012 should be completed. The USB-IF is working to this end together with the standards body for the mobile industry maintains, the MIPI Alliance. When then mobile phones or tablets with the interface will be fitted, to the manufacturers. The expectation is that the current interfaces, by that time, no longer comply, and manufacturers are forced to faster interfaces to implement.