Hynix announces more fuel-3GB-modules for smartphones and tablets

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Hynix to start early next year the mass production of 6Gb lpddr3 on a 2xnm-proced lwa. The memory chips have their way to go to 3GB modules for high-end smartphones and tablets. Now contain the most mobile devices maximum of 2GB lpddr3.

The memory works at 1866MHz and can are 32bit-interface single channel, with 7.4 GB/s in dual channel so have 14.8 GB/s processing. It is going to be 6Gb lpddr3 which is, by four in a module can be placed for a total capacity of 3GB.

Hynix makes all 4Gb lpddr3 and Samsung announced at the end of July to lpddr3 on 2xnm production. Those chips are now in a 3GB package in the Galaxy Note III. Samsung has, however, six 4Gb chips will be required, and at the end of this year, the mass production of 6Gb lpddr3 start. The advantage of the 6Gb chips is the smaller size and energy efficiency: according to Hynix, the chips are 30 percent more fuel-efficient in standby mode than the 4Gb chips.